We support NAND01GW3A0AN6 TSOP48 on SP6100 now. NAND01GW3A2B uses the same algorithm. But the chip package is Unsawn wafer. This is a silicon wafer. “Unsawn” means that the wafer is not cut into small pieces. You test this using wafer probes. These are very sharp set of pins making contact with pads on each chip on the wafer. Testing method of a wafer cannot be same as programming a final chip because they want to spend minimal time to locate defective chips, but not program all area. So we need to know your test criteria.
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